Ultech manufactures and offers to its customers a broad range of systems for sputtering (including roll to roll), PLD, evaporation and other deposition technologies (CVD and ALD, including PECVD and PEALD) . In addition to that, both vertical and horizontal LPCVD furnaces are available. Below are some examples of the tools that are included in Ultech’s product offer, for a complete list of tools or specific questions on any tool feel free to contact us.
SPS MC Series
- Multi chamber system
- Up to 6-inch substrates
- Single wafer
- Up to 6 targets
- Flexible module configuration
This system’s main applications are coating of all common materials (metals, alloys, dielectrics), magnetic film and reactive film coating, interleaving conducting, semi-conducting, and insulating layers coating, reflective and ARC coating, optical and opto-electronic films coating. Maitenance can be done separately on chambers, which facilitates maintenance work and shortens start up time.
- Flexible use of 1 or 2 stacks
- High throughput batch process
- Automatic loading and unloading of the system
- Excellent temperature uniformity
The tool’s main applications are low stress/stochiometric silicon nitride, poly/doped-poly silicon, silicon oxide and LTO. A separated circuit protects the furnace from exceeding temperature limit.
E-beam evaporator (SEE-7 Series)
- Batch system
- Various different wafer sizes
- High deposition rates
- Optional substrate heating
- Crystal thickness sensor
The tool’s main applications are monolayer or multilayer conventional materials coating, alloy metal coating, organic materials coating and optical coatings of rotational symmetry planes.
PECVD (PES-P Series)
- Single wafer
- Up to 8-inch substrates
- PC control
- Wide temperature range options
The tool’s main applications are active optical device layers, interlayer dielectrics and gate oxide.
Ultech also owns a 10,000 class clean room where they can run demos upon request.