Ultech manufactures etching and stripping systems for all needs, including RIE-ICP systems, DRIE systems, wet etchers, wet benches and ashers. Below you can see a brief description of some of the tools that are currently part of Ultech’s product offer. As an addition to the standard offer Ultech can, upon request, customize its tools according to customer’s requirements. You can contact us for additional information.
ICP-RIE System (PERI series)
- Single wafer
- Up to 8-inch substrates
- Mechanical wafer clamp
- PC control
This system is a very versatile and complete tool with several applications: DRIE, III-V, oxide, nitride, metal and silicon etch.
RIE System (URS Series)
- Designed for R&D
- Single wafer
- 4 to 6 inches substrates
- Manual touch screen control (optional PC control)
The tool’s applications are bulk/poly silicon etching, dielectrics etching and polymide etching.
- Minimal foot print from optimized design in fluid tank
- Reduced use of chemicals and pure water thanks to efficient pipe design
- Up to 8 inch, 1 cassette (25 wafers)
The tool’s main applications are photoresist stripping/developing and RCA cleaning. A mixing of cleaning/chemical etching/solvent/developer bench is also available.
Ultech also manufactures small wet etch systems for Si anisotropic, membrane and microchannel formations, PSL, electroplating, V-Groove, U-Groove and cavity formation. As an additional product, a downstream RF plasma asher for resist films (with optional substrate heating) is also available.